Toshiba Electronics Europe (TEE) has announced a transistor output photocoupler in a low-height, wide body SO6L package, which can be used to replace conventional DIP4 packages. The new product – TLP385 – offers a high isolation performance. It guarantees a minimum creepage and clearance distance of 8mm and isolation voltage of 5kVrms (min).
Recommended: Buck-Boost Converters Optimized for Automotive Systems
With a height of just 2.3mm (max), a 45% reduction from DIP4 type package products, the TLP385 can be used in situations where there are strict height limits, aiding the development of ultra-low profile products. It can be used for applications including inverter interfaces and general-purpose power supplies.
Operating temperature range is -55 to +110 degrees C. It is approved to UL, cUL and CQC safety standards and is also available as VDE EN60747-5-5 approved type.
source: http://www.powerpulse.net/story.php?storyID=30986
Comments are closed.
