Fairchild Semiconductor Corp.announced today the availability of its next generation PowerTrench® MOSFETs for automotive applications in the high-power TO-Leadless (TO-LL) package (JEDEC MO-299). The innovative TO-LL technology offers an extremely low package resistance, a very small footprint, and allows for exceptionally good EMI behavior. Typical automotive power electronics applications for the TO-LL packaged devices include battery management for electric and hybrid-electric vehicles, battery safety switches, start-stop systems, as well as motor drives for EPS (electric power steering) and active rectification alternators.
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Fairchild offers devices optimized for traditional 12V battery systems as well as solutions supporting new board-net architectures, such as 48V. The devices announced today include: FDBL9401_F085, 40V / 0.65mΩ; FDBL9403_F085, 40V / 0.9mΩ; FDBL9406_F085, 40V / 1.2mΩ; FDBL86561_F085, 60V / 1.1mΩ; FDBL86563_F085, 60V / 1.5mΩ; FDBL86361_F085, 80V / 1.4mΩ; FDBL86363_F085, 80V / 2.0mΩ; FDBL86366_F085, 80V / 3.2mΩ; and FDBL86210_F085, 150V / 6.3mΩ.
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At just 2.3 x 9.8 x 10.38mm, the TO-LL package is about 30 percent smaller compared to a D2PAK (TO263) package and supports up to 300A current handling capabilities. The TOLL is almost half the height, which makes it ideal for many automotive applications where space is usually tight.
The combination of Fairchild’s latest PowerTrench shielded gate trench technology with the TO-LL package gives Fairchild’s leadless MOSFET products their extremely low RDS(on) ranges. Both the superior silicon technology as well as the package design result in excellent switching and EMI performance, which is particularly beneficial for switching and PWM controlled applications in particular and has been verified by early customers of the devices. At the same time, it simplifies design, avoids additional passive components and overall enables electronic manufacturers to better serve the markets for high-current applications. Compared to other discrete packages, the number of parallel MOSFETs needed in high-current applications can be significantly reduced, if not eliminated, leading to overall lower system costs.
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Fairchild’s TO-LL portfolio now includes 40V, 60V, 80V as well as 150V ratings and will extend to 100V types over the coming months. The TO-LL package features very low package parasitic compared to a D2PAK (TO263) package. Its inductances are only half the amount and the package resistance is only 40 percent. Unlike many other leadless packages, the TO-LL allows for automated optical inspection (AOI) thanks to its tin-plated lead tips. AOI is often a must for Surface Mount Technology (SMT) production lines as it supports low inspection cost compared to X-ray systems.
source: http://www.powerpulse.net/story.php?storyID=31706
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