Molex Incorporated announced today the expansion of its EXTreme Ten60Power™ connector portfolio to include wire-to-board and panel-to-board power-only and hybrid power-and-signal options, joining the existing board-to-board power delivery system. The new additions provide design engineers in the data computing, telecommunication, and networking fields with greater flexibility to meet a wide range of harnessed power and signal requirements while delivering the high current density and low power loss required in these applications. EXTreme Ten60Power harnessed solutions provide up to 55A per contact of current while utilizing proven Molex power and signal contact designs. The entire family of products will be showcased at DesignCon 2015, January 28 – 29, Santa Clara, CA, booth 619.
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“High-current power customers are confronted with the need to be extremely efficient – providing more power in less space without drastically increasing their costs. Our commitment at Molex has been to meet their emerging power needs while being mindful of budget considerations,” said Jeff Torres, global product manager, Molex. “The EXTreme Ten60Power family has been designed to deliver best-in-class current density while offering designers a wide range of options to meet their specific power requirements as closely as possible without having to pay for excess contacts. In addition, the low-profile design maximizes equipment space and enhances system airflow for lower heat-related resistance.”
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By allowing either a power-only or hybrid power-and-signal combination, the system increases the number of possible configurations for even greater design flexibility. The wire-to-board versions are available in right-angle and vertical PCB plug mating. Panel-to-board options mate a panel mount receptacle harness to a standard EXTreme Ten60Power right angle header with the panel-mount receptacle flange affixing to either the front or back of the panel.
source: http://www.powerpulse.net/story.php?storyID=31500
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