MALVERN, Pa. — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company’s Si8851EDB TrenchFET® p-channel Gen III power MOSFET has received a 2013 Power Supply Products Award from Electronic Engineering & Product World magazine (EEPW), one of China’s leading electronics industry publications. The annual EEPW Power Supply Products Award program — now in its 11th year — is open
RESEARCHERS at Caltech have devised a method to protect the semiconductors in solar-fuel generators. Solar-fuel generators use sunlight to split water, yielding hydrogen gas that can then be used as a clean fuel. Water is oxidated to produce oxygen gas, then reduced for hydrogen. These devices are currently in the development stage, but would require efficient light-absorbing materials that attract
Spansion Inc. today announced a new family of power management integrated circuits (PMICs) for energy harvesting that can enable a greener Internet of Things (IoT) by eliminating the need for or extending the life of batteries in a multitude of IoT devices from individual wearable electronics to the nodes in wireless sensor networks. The Spansion Energy Harvesting family includes the
Scaleo has announced the first microcontroller family made on Global Foundries 55nm automotive-specific chip process. The microcontroller, called Olea, has “unique technologies related to real-time process and control of highly electrified internal combustion engines and electric motors based on programmable logic, as well as a set of ISO 26262 compliant functional safety features which improve powertrain system safety integrity
Today, Texas Instruments (TI) (NASDAQ: TXN) announced the mass production of the world’s most advanced automotive-grade wireless connectivity devices, the WiLink™ 8Q family. With integrated Wi-Fi®, Bluetooth®, Bluetooth low energy and GPS/GNSS technologies, customers receive an all in one AEC-Q100 qualified chip. WiLink 8Q delivers a complete wireless connectivity experience for automotive infotainment systems. As Wi-Fi is gaining momentum in
Vishay Intertechnology, Inc. released the first AEC-Q101-qualified TrenchFET® power MOSFETs to feature ThunderFET® technology. To increase efficiency and save space in automotive applications, the Vishay Siliconix 100 V n-channel SQJ402EP, SQJ488EP, and SQD50N10-8m9L offer some of the lowest on-resistance values available in the PowerPAK® SO-8L and DPAK packages. Vishay’s ThunderFET technology enables lower on-resistance per die area. In applications where
The Alliance for Wireless Power (A4WP) today announced continued momentum on the expansion of the organization’s Rezence-based wireless charging capabilities, becoming the first to deliver a specification for multi-device wireless charging up to 50W. Increasing the standard to 50W expands the range of products capable of using Rezence technology beyond smartphones to include laptops, tablets, and other consumer electronics. To
The shielded CDRH3D23 Series Power Inductors from Sumida America Components Inc. are specifically designed for use in high-density power circuitry. With ferrite drum construction and a unique geometry, these devices yield higher inductance values than other inductors with a similar footprint. These devices measure just 3.92 x 3.92 x 2.5 mm. Inductance values range from 0.47 µH – 47 µH.
Yuasa Battery Sales (UK) has announced the availability of new battery modules for its LIM family of industrial Li-ion batteries. Designed for use in a wide range of applications including energy storage, traction motors and regenerative energy recycling, the new battery modules incorporate multiple LIM series battery cells along with a battery monitoring unit (ACS) and a temperature sensor. The
DALLAS, June 3, 2014 — Texas Instruments expanded its RF portfolio today with the addition of high-performance RF gain blocks, down-converting mixers and a complex modulator that provide the industry’s best combination of power and performance. The new RF devices are being demonstrated this week in TI’s booth at the International Microwave Symposium and complement TI’s existing portfolio of transmit