Intepro Systems announces the introduction of the PEL Regenerative AC Electronic Load Bank. Built around a 60 kVA chassis, the system can be paralleled for higher power requirements. It also accepts standard AC input ranges from 120 to 480V and provides grid-synchronized, regenerated ac power output that returns 90% of the equipment under test (EUT) load power back to the
Schaefer, Inc. announces the C/B 600 Series of dc-dc and ac-dc converter modules and battery charger (B600 models). The highly-reliable, compact and rugged 3U design uses industrial-grade components and provides a high-density, space saving solution for applications in industries such utility, oil/gas, automation, heavy industrial, military, telecom/datacom, alternative energy, transit/railway, process control, and power stations. Recommended: Emerson to Spin off
STMicroelectronics has introduced the industry’s first automotive high-side drivers to meet the cold-cranking specification of the German car industry’s LV124 test schedule, making them well-suited for vehicles with stop-start technology. The new VND7050AJ12 and VND7140AJ12 have minimum supply voltage of 3.2V to keep essential equipment such as dashboard instruments operating as the vehicle battery voltage dips during engine cranking. The
Linear Technology Corporationintroduces the LT4276 LTPoE++™, PoE+ and PoE-compliant powered device (PD) interface controllers for applications requiring 2W to 90W of delivered power. The LT4276 integrates a PD controller and an isolated switching regulator controller, capable of synchronous operation in both forward and flyback topologies with auxiliary power support. This integration simplifies front end PD designs by reducing component count
Allegro MicroSystems, LLC introduces a new family of contactless, Hall-effect based magnetic sensor ICs for high-speed motor position sensing applications. Allegro’s dual-die A1331 and A1334 angle sensor ICs are based on vertical Hall-effect technology. The A1331 and A1334 devices, with their system-on-chip (SoC) architectures, provide fast output refresh rates and low signal path latency to support a wide variety of
Micrel, Inc. announced the availability of the MIC24046-H, a high efficiency (>90 percent peak), pin-configurable 5A synchronous buck converter in a tiny 3mm x 3mm QFN package. The device features pin selectable output voltage, switching frequency and current limit settings which improve design flexibility and eliminates multiple external components. The solution targets end equipment such as network switches/routers, servers, storage,
The continual introduction of new electronics-based features in cars, including various Advanced Driver Assistance Systems (ADAS), has led to a proliferation of communications protocols that offer different combinations of speed, cost, and flexibility. Now,STMicroelectronics has introduced two new devices that combine superior protection of CAN (Controller Area Network) bus lines against electrostatic discharges and other transients and market-unique compliance with
TE Connectivity announces its new COPALUM Lite sealed terminals and splices that provide up to 60 percent in weight savings versus copper terminal alternatives, and up to 53 percent weight savings versus drop-forged aluminum terminals. The new terminals are rated for 152 to 303 Amps and feature the time-tested dry crimp technology that has provided three decades of reliable connectivity
Teseq, a unit of AMETEK Compliance Test Solutions, introduces two high-voltage artificial networks designed for conducted emission tests and line termination during susceptibility tests for components. The HV-AN 150 and HV-AN S150 are designed for use in automotive, military and airborne standards applications. These two new line impedance stabilization networks (LISNs) offer a unique approach to e-mobility as well as
inTEST Corporation today announced the introduction of two benchtop systems for temperature testing integrated circuits (ICs), including high-watt emitting devices by inTEST’s Thermal Solutions (iTS). The Temptronic® ThermoSpot® consists of a highly responsive benchtop temperature forcing unit that feeds a thermal head through a flexible umbilical. The thermal head is designed with an interchangeable ThermoBridge™ to mate directly to an