Tag: battery industry news

TDK Corporation announces the introduction of high temperature resistant MLCCs with soft terminations, expanding the CGA series of MLCCs for automotive applications. These components employ electrodes made of conductive resins that provide effective protection against solder cracks caused by thermal cycling, flex cracks caused by stress to the PCB, and damage due to vibrations and shocks. In addition, the new

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Semtech Corporation today announced the SC563, a dual-output low dropout (LDO) regulator in a tiny 1.6mm x 1.2mm, 8 pin MLPD package. The SC563 LDO provides two regulated outputs for up to 300mA for each output channel. The LDO accepts an input supply rail of 2.3V to 5.5V and provides two fixed, regulated outputs, which eliminate the need for external

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Eaton Corp. today announced the launch of its automotive grade Coiltronics® HCMA Series of high-current power inductors to meet and exceed the Automotive Electronics Council’s (AEC) Q200 Grade 3 standard with a maximum total temperature operation range from minus 55 to 125 degrees C. The HCMA Series is provided in surface mount packaging with a range of compact heights beginning

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Efficient Power Conversion Corporation (EPC) announces the introduction of two eGaN FETs that raise the bar for power conversion performance. These products have a maximum operating temperature of 150 degrees C and pulsed currents capabilities of 260A (150 V EPC2033) and 140A (EPC2034). Applications include dc-dc converters, synchronous rectification in dc-dc and ac-dc converters, motor drives, LED lighting, and industrial

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Renesas Electronics today announced the RL78/G1F Group of multi-function microcontrollers (MCUs), adding 20 new members to its low-power RL78 Family of MCUs. Featuring enhanced peripheral functions and compatibility across the RL78/G1x Series of MCUs, the new devices simplify sensor-less brushless dc motor (BLDC motor) control and deliver precision operation at faster rotational speeds with high accuracy for energy-efficient home appliances

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Eaton Corp. announced the introduction of its eATS30 Monitored platform for data centers in North and South America. Designed to switch non-phase alternating current (AC) power sources in the event of a power failure, Eaton’s latest rack automatic transfer switch (ATS) is designed to allow for consistently resilient uptime for equipment with a single power supply. Eaton’s newest offering is

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Linear Technology Corporationintroduces the LTM4630-1, a dual 18A or single 36A µModule® (micromodule) regulator with high precision output voltage regulation for 28nm and sub-28nm FPGAs, ASICs and microprocessors. The core voltage of these advanced digital devices requires very accurate voltage regulation at steady state (dc) and at fast load current transients. The LTM4630-1 provides precision output voltage regulation for both

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Texas Instruments (TI) today introduced the first power management chipset with intelligent digital control and a unique body-diode sensing feature to optimize secondary-side synchronous rectification in next-generation ac-dc and isolated dc-dc power supplies. The UCD3138A digital controller and UCD7138 low-side gate driver improve system efficiency and cut synchronous rectification MOSFET voltage stress in half compared to other digital-power solutions. Recommended:

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Efficient Power Conversion Corporation (EPC) announces the introduction of three eGaN FETs designed with a wider pitch connection layout. These products expand EPC’s family of “Relaxed Pitch” devices featuring a 1 mm ball pitch. The wider pitch allows for placement of additional and larger vias under the device to enable high current carrying capability despite the extremely small 2.6 mm

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Analog Devices, Inc. (ADI) today introduced an absorptive single-pole, double-throw (SPDT) switch specified for the 9-KHz to 13-GHz frequency band, with high isolation of 48 dB and low insertion-loss of 0.6 dB at 8-GHz operation. The HMC1118LP3DE is the first offering within ADI’s new RF and microwave control product portfolio to exhibit the inherent advantages of silicon process technology, which

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