The STNRG digital-controller family, new from STMicroelectronics, helps designers maximize the advantages of digital power conversion, including high efficiency under all load conditions, enhanced safety, rich diagnostics, and convenient network connectivity. Rugged enough for high-end industrial applications as well as outdoor equipment such as solar-power converters, EV charging stations, and industrial switched-mode power supplies, the STNRG ICs contain ST’s unique
At this year’s PCIM 2015 trade showInfineon Technologies AG will present the latest generation of its PrimePACK™ power modules which benefit from the new generation of Infineon’s IGBTs. The combination of the IGBT5 and the innovative .XT interconnection technology is an important milestone in IGBT chip and interconnection technologies. The IGBT5 allows for higher power density with reduced static and
Eaton Corp. today announced new metered outlet power measurement capabilities for data centers with its best-in-class ePDU® third-generation (G3) platform in the Americas. Providing capabilities to monitor and measure critical factors such as voltage, current and power consumption, Eaton’s latest rack power distribution units (PDUs) help information technology (IT) and data center managers conserve energy with one percent billing grade
CMicrotek LLC is expanding their µCurrent Probe™ line of ultra-low current probes, optimized for the low current levels of small energy harvesting power sources. The newest member of the µCurrent Probe line is the µCP120™, extending the current range of the µCP100™ (5nA up to 100mA) for higher power applications. The µCP120 has a measurement range from 50nA up to
TDK Corporation has expanded its CCT series of clamp ac current sensors with two new types that are rated for 300A and 80A. The new sensors are designed for use in the power distribution panels in a variety of energy management systems. With a current transformation ratio of 3000:1 the 300-A and 80-A types offer maximum output currents of 100
Truly Semiconductors Limited (Truly) andSunpartner Technologies signed a partnership to develop the first turnkey display modules integrating Wysips® Crystal technology, for the smartwatch market and other mobile electronics. Wysips® Crystal solar recharging technologies transform any surface into a source of electricity using natural or artificial light without impacting aesthetics-like a perpetual power reserve. Installed under the touchscreen panel during the
To be premiered next week at PCIM Europe 2015, STMicroelectronics‘ powerSTEP driver delivers the advantages of compact motor-control design for applications at high power ratings. The fully-integrated stepper-motor driver system-in-package offers an unprecedented power density of up to 500W/cm², enabling cost-effective systems that deliver better performance and reliability without sacrificing flexibility or ruggedness. Recommended: 5A Charger IC Cuts Charge Time
LAPIS Semiconductor, a ROHM Group Company, has recently announced the development of a low-power microcontroller (MCU) that integrates an 8-bit core, speech synthesis circuit, high-efficiency Class-D speaker amp, non-volatile memory, and oscillator circuit on a single chip, making audio playback possible by simply connecting to a speaker. The ML610Q304 also provides hardware-based audio playback operation that minimizes the load placed
Microchip Technology Inc. today announced the 14-member dsPIC33EP “GS” family of Digital Signal Controllers (DSCs). The dsPIC33EP “GS” family delivers the performance needed to implement more sophisticated non-linear, predictive and adaptive control algorithms at higher switching frequencies. These advanced algorithms enable power supply designs that are more energy efficient and have better power supply specifications. Higher switching frequencies enable the
Maxim Integrated Products, Inc.addresses the need for higher throughput, smaller footprint, and lower power in industrial automation with the MAX14900E digital output switch. This eight-channel integrated circuit (IC) provides up to 70x faster speed, uses over 20% less power, and occupies 40% less space than existing solutions—all factors required in today’s faster, more localized, smaller end products. It is controlled