NXP Semiconductors has released its first medium-power Schottky rectifier PMEG45T15EPD with Trench technology in CFP15 (SOT1289) FlatPower package. Due to the Trench process, the new type offers a very low reverse current of only 30µA. The voltage drop value remains about the same compared to planar types. Furthermore, it delivers a reverse voltage of 45V and an average forward current of 15A. Key applications include: high-efficiency dc-dc conversion, switch mode power supplies, freewheeling applications, reverse polarity protection, and various applications that demand low-power consumption.
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The rectifier is housed in an ultra-thin CFP15 package, with a package height of only 0.78mm, integrated clip-bond technology and a large heat sink. It is capable of temperatures up to 150 degrees C. This makes it highly-suitable for applications such as high-efficiency low-power adapter, especially at high operating temperatures.
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Key features and benefits include: Average forward current: IF(AV) ≤ 15 A; Reverse voltage: VR ≤ 45 V; Low forward voltage, VF typ = 480 µA (at 15 A); Low leakage current, IR typ = 30 µA (at 45 V) due to Trench MEGA Schottky technology; High-power capability due to clip-bonding technology and heat sink; and Small and thin SMD power plastic package, typical height 0.78 mm.
source: http://www.powerpulse.net/story.php?storyID=32765
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