Toshiba America Electronic Components, Inc. (TAEC) today announced the expansion of its lineup of ultra-small photorelays with the addition of four products: the TLP3417, TLP3420, TLP3440 and TLP3475. The new products are suited for system solutions in various applications, including semiconductor testers, measurement equipment, probe cards and medical equipment. The new products are housed in the industry’s smallest package for photorelays, the Toshiba-developed VSON4 package. The VSON4 package enables high-density assembly and, by replacing USOP4 packages, can shrink the assembly area by 50 percent and the assembly volume by 60 percent.
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The TLP3440 has improved leakage characteristics against high frequency at off-state, while the TLP3475 has improved high speed signal transmission characteristics at on-state. For high voltage measurement requirements, including SoC testing, the TLP3417 supports 80V, while the TLP3420 supports 100V. The new products have the same electrical characteristics as the conventional Toshiba USOP4 series products, making it easier to evaluate them as replacement products. All devices achieve 3mA (max) trigger LED currents and 300Vrms (min) isolation voltages.
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