Infineon Technologies AG andSchweizer Electronic AG jointly-announced today that Infineon will acquire a 9.4 percent stake in Schweizer. Both companies agreed on strict confidentiality on the terms. By investing into Schweizer Infineon emphasizes its intention to jointly-develop technologies for the integration of power semiconductors into PCBs and to tap the chip embedding market for high-power automotive and industrial applications. Schweizer’s
Linear Technology Corp. announces the LT3790, a synchronous buck-boost dc-dc controller that delivers up to 250W of power with a single IC. Its 4.7V to 60V input voltage range makes it ideal for a wide variety of automotive and industrial applications. Its output voltage can be set from 0V to 60V, making it well-suited as a voltage regulator or battery/supercapacitor
Infineon Technologies AG today launched bipolar power modules in solder bond technology to address the specific requirements of cost-effective applications. With these new PowerBlock modules the company expands its already extensive power module portfolio which, so far, was only using pressure contacts. Infineon offers optimized solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and
With fully-adjustable output slew rates, the 5V dual-channel AP22966 load switch from Diodes Incorporated provides simple and cost-effective soft-start functionality for improving 3.3V and 5V system power reliability in notebook, tablet and datacom products. The device’s two N-channel MOSFET outputs can be independently controlled, with slew rates set via ground-connected external capacitors on its soft-start inputs. Recommended: 10-W Wireless Power
Toshiba Electronics Europe (TEE) has extended its family of silicon carbide (SiC) devices with the launch of a high-efficiency 3300V, 1500A power module. The MG1500FXF1US71 PMI (plastic case module IEGT) integrates an N-channel IEGT (injection-enhanced gate transistor) and an SiC fast recovery diode (FRD) into a package with a footprint of just 140mm x 190mm. Toshiba’s new module will save
Gaia Converter S.A. has expanded its ultra-wide input voltage range dc-dc converters targeting railway, transportation and high-end industrial applications. The MGDDI-20 Series 12-160V input voltage range is designed to cover all typical battery/bus voltages at once (24V, 36V, 48V, 72V, 96V, 110V, 125V) with the same device. This unique performance is achieved as a result of Gaia’s proprietary switching techniques
The STGAP1S advanced single-channel gate driver, launched today bySTMicroelectronics, Inc. integrates galvanic isolation with analog and logic circuitry in the same chip to help simplify driver design while ensuring high noise immunity for safe and reliable power control. STGAP1S is the first in ST’s new generation of gapDRIVE™ gate drivers, which combine proprietary bipolar-CMOS-DMOS (BCD) process technology with innovations that
Electric-car charging stations are still remarkably rare at gas stations, though a handful exist in the Pacific Northwest. But earlier this year, the Petro-Canada station in Crossfield, Alberta, installed a charging station. It’s free to use, too. Perhaps not too remarkable, except that this is the heart of Canada’s tar-sands oil region. The charger itself is a Sun Country 100-amp
According to the researchers, the approach is to design synergistic materials by combining two single-atom thick sheets, for example, acting as a photovoltaic cell as well as a light-emitting diode, converting energy between electricity and radiation. However, combining layers of atomically thin material is a thorny task that has flummoxed researchers for years. The new material interlocks in a similar
According to a joint press release from Infineon and Schweizer, the chipmaker has acquired 9.4% of Schweizer’s shares at an undisclosed amount. The move underscores Infineon’s intention to jointly develop technologies that aim at the integration of power semiconductors into the printed circuit board. The goal is developing the ability to embed high-power semiconductors for automotive and industrial applications into