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20
Mar

Mid-Voltage MOSFETs Rated at 175 C deliver Higher Power Densities

Fairchild Corp. has announced an expanded line of extended temperature (ET) mid-voltage MOSFETs, which can operate at 175 degrees C. The higher operating temperatures enable up to 85 percent greater power density and three times more reliability than MOSFETs rated to the 150 degrees C industry standard. This new family of ET MOSFETs aligns with the IPC-9592 power conversion standard,

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20
Mar

GaN Transistors rated for 600V handle up to 15A

Panasonic Semiconductor Solutions Co., Inc. has extended its line of GaN power transistors with two new devices, the PGA26E19BV rated for 600V and 10A and the PGA26E08BV rated for 600V and 15A. These normally-off power switches are offered in an 8mm square 1.25mm thick package for high-density applications. They are fabricated on Panasonic’s 6-inch GaN-on-silicon process. Applications are expected to

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20
Mar

Next-Gen Data Center Infrastructure Management Tools

FieldView Solutions, Inc. today announced the availability of FieldView 2015 Data Center Infrastructure Management (DCIM) tools. The new solution’s innovations represent a dramatic leap forward in improving data center resilience by capturing, correlating and analyzing massive amounts of live data, enabling “What If?” simulation of potential failures, contemplated changes and planned maintenance downtime. Customizable dashboards enable vivid presentation of operational

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18
Mar

Tantalum Capacitors for High-Power DC-DC Converters

AVX Corporation has introduced the new TCR Professional Series tantalum chip capacitors with conductive polymer electrodes. Designed for use in high-power dc-dc converters employed in telecommunications, industrial, and avionics applications that demand high reliability and long lifetime performance, TCR Professional Series capacitors are subjected to AVX’s maverick part control Q-Process with statistical screening and process control enhancement to ensure the

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18
Mar

GaN Power Switches with Topside Cooling Simplify PCB Design

GaN Systems Inc. today announced new topside cooling technology in its wide range of high-power enhancement-mode devices. Topside cooling enables engineers to use conventional, well-understood PCB cooling techniques when incorporating GaN Systems’ market-leading semiconductors into their latest designs for products such as inverters, UPS, hybrid electric vehicles/electric vehicles, high voltage DC-DC conversion and consumer products such as TVs. Recommended: TI

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18
Mar

1200V/1700V Dual-IGBT Drivers with More Protection Features

Power Integrations, Inc. launched its latest SCALE™-2+ dual IGBT-driver core, the 2SC0435T2G1-17, which is the most compact product in its power range with a footprint of only 57.2 x 51.6 mm and a height of just 20 mm. The new SCALE-2+ technology enables Soft Shut Down (SSD) to be implemented in the event of a short circuit without requiring additional

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18
Mar

40V FETS Claim Industry-Leading Low RDS(ON)

Toshiba America Electronic Components, Inc. (TAEC) announced the launch of its 40V power MOSFET U-MOS IX-H series. This family of low-voltage, ultra-efficient trench MOSFETs is based on Toshiba’s next generation U-MOS IX-H semiconductor process. The U-MOS IX-H process realizes the lowest ON-resistance in the industry, compared to Toshiba’s conventional U-MOS VI-H series. The new MOSFETs also realize a low Qoss,

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18
Mar

Six-Output Programmable PMICs for Consumer and Industrial Uses

Micrel Inc. today introduced the MIC7400/MIC7401, a new family of highly integrated and configurable power-management IC (PMIC) solutions featuring six independent dc-dc regulators. Available in a small 4.5mm x 4.5mm FQFN package, this product family provides one of the industry’s highest power density solutions with total solution size of 12mm x 8mm x 1mm. The MIC7400/MIC7401 combine a total of

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18
Mar

Rogowski Probes Measure Power SiC and GaN Switch Currents

To meet the demands of measuring transient currents in semiconductors using new technology, such as SiC and GaN, Power Electronic Measurements Ltd. (PEM) has designed the CWT MiniHF Rogowski current probe. Combining a novel shielding technique, utilizing a low sensitivity coil and patented low-noise signal-conditioning circuitry, the wide-band screened probe boosts immunity to local dV/dt transients while maintaining small size,

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18
Mar

DC-DCs Deliver up to 1,244 W/in3 Power Density

Vicor Corporation announced the expansion of the DCM Converter Module Series of isolated, regulated DC-DC converters within Vicor’s Converter housed in Package™ (ChiP) power component platform. This series now covers critical applications in Aerospace, EV/HEV, Rugged Systems, Industrial, and Telecom/Datacom. DCMs provide nominal input voltages of 24, 28, 48, 270, 290, and 300 Volts with nominal outputs of 48, 36,

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