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NXP Semiconductors N.V. today announced its new GreenChip power solution, the TEA1916+TEA1995 platform – an innovative and easy-to-design new Resonant LLC solution targeted for desktop PC/AiO, gaming consoles, notebook adapters and large panel TVs. Building on NXP’s success as the market leader in GreenChip power ICs, the new TEA1916+TEA1995 Platform offers very high efficiency over the entire load range, especially

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Gowanda Electronics has introduced its new SMP2512 Series of surface-mount, wirewound, ferrite core, molded power inductors. This series addresses a market need for a specific combination of size and performance in the power electronics industry and is designed for use in power applications for specific surface mount size – nominally 0.25 inch L x 0.10 inch W – and current

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Fujitsu Laboratories Ltd. announced the development of the world’s first thin cooling device designed for small, thin electronic devices. Smartphones, tablets, and other similar mobile devices are increasingly multifunctional and fast. These spec improvements, however, have increased heat generated from internal components, and the overheating of localized parts in devices has become problematic. Fujitsu has developed a thin loop heat

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Intersil Corporation today claimeded the industry’s first 50A fully encapsulated digital dc-dc PMBus power module. The ISL8272M is a complete step-down power supply that delivers up to 50A of output current from industry standard 12V or 5V input power rails, and four modules can be combined to support up to 200A rails. It provides point-of load conversions for advanced FPGAs,

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FuturoLighting has introduced an extension to its range of smart LED solutions. Smart DC LED module connects the most recent LED technology together with a smart dc driver offering a ready-made solution for fixture producers and researchers. The module is populated on metal core PCB, implementing LEDs and high an efficiency driver with thermal foldback and dimming. Advantage of the

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Ericsson Power Modules has launched a new two-phase 90A 3E digital point-of-load (POL) dc-dc power module that offers compensation-free performance and the ability to easily connect modules in parallel to provide up to 360A to advanced network-processors that require high performance in power delivery and high levels of software control to improve flexibility. These advanced capabilities make the BMR465 ready

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Texas Instruments, Inc. (TI) today introduced the industry’s first 80-V, 10-A integrated gallium-nitride (GaN) FET power-stage prototype, which consists of a high-frequency driver and two GaN FETs in a half-bridge configuration – all in an easy-to-design quad flat no-leads (QFN) package. TI has an arranged supplier agreement with Efficient Power Conversion Corp. (EPC) for GaN FETs – the LMG5200 is

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Silego Technology, Inc. today announces the fourth generation of GreenPAK (GPAK) Mixed-signal Matrix ICs. The GPAK4 family strengthens Silego’s industry leading position in Configurable Mixed-signal ICs (CMIC). Silego’s GPAK4 family of NVM Programmable CMIC devices enables innovative designers to integrate many system functions such as comparators, ADCs, logic, delays, counters, resets, power sequencing, voltage sensing, and interface circuits while minimizing

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Mean Well Enterprises Co. Ltd. has unveiled the 90W green adaptor, dubbed the GST90A series, which complies with the up-to-date energy efficiency regulations (EISA 2007/DoE Level VI). The newly-designed GST90A is equipped with a no load power consumption (less than 0.15W) and an average operating efficiency that are superior to GS90 which is already released to the market; GST90A is

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New zipper fin heat sinks from Advanced Thermal Solutions, Inc. (ATS) are protecting thousands of components from the dangers of excess heat at a lower cost than other high fin density heat sink types. Zipper fins are machined from thin sheet metal, typically aluminum or copper, and are formed into custom shapes. The sheets are designed to interlock with a

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