admin

Toshiba Corporation‘s Semiconductor and Storage Products Company today announced the launch of a new surface-mount package series in its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation. The shipment of the 4 new products in the “DSOP Advance package” series starts immediately. Recommended: NXP claims World-Thinnest Medium-Power Schottkys The new devices have a heat sink

Read more

The STWBC digital controller for wireless battery charger (WBC) transmitters fromSTMicroelectronics, Inc. claims the most flexible and efficient solution for controlling power transfer from a WBC transmitter (TX) to a receiver (RX) in WBC-enabled phones, wearables, and other battery-powered devices that use electromagnetic induction for re-charge. As a member of the Qi Wireless Power Consortium and the PMA (Power Matters

Read more

Fairchild Semiconductor Corp.announced today the availability of its next generation PowerTrench® MOSFETs for automotive applications in the high-power TO-Leadless (TO-LL) package (JEDEC MO-299). The innovative TO-LL technology offers an extremely low package resistance, a very small footprint, and allows for exceptionally good EMI behavior. Typical automotive power electronics applications for the TO-LL packaged devices include battery management for electric and

Read more

Linear Technology Corporationannounces the LTC3899, a triple output (buck, buck, boost) 29µA quiescent current, synchronous dc-dc controller that maintains output voltage regulation over a 2.2V to 60V input range. A 12V car battery can droop to less than 4V during engine restart or cold crank, causing reset of infotainment systems and other electronics that operate from 5 V and higher.

Read more

Acopian Power Supplies today announced the availability of the WN8B power supply, a member of the Narrow Profile, three-day power supply series of switching regulated power supplies. The ac-dc single-output units provide up to 75 Watts of output power, with convection cooling (no fans required). The convection-cooled design eliminates the need for fan maintenance, along with audible/ambient noise and vibrations.

Read more

Cypress Semiconductor Corp. today introduced a new, low-cost prototyping kit that gives engineers unprecedented access to design with the powerful 32-bit ARM® Cortex®-M3 core in Cypress’s PSoC® 5LP programmable system-on-chip architecture. The $10 CY8CKIT-059 Prototyping Kit delivers PSoC 5LP’s ability to reduce systems costs by integrating analog front-ends, digital logic and user interface ICs with the architecture’s programmable analog and

Read more

TDK Corporation presents the EPCOS RingCap – a power capacitor with an innovative design that is especially suitable for xEV applications. Thanks to its ring configuration, the new RingCap can be integrated into a clutch bell housing or wheel hub motors. The dimensions of the capacitor can be adapted according to the specific requirements of the customer: The outer diameter

Read more

Targeting the makers of LCD monitors, all-in-one PCs and video projectors, the PAM8009 from Diodes Incorporated is a 3W stereo class-D audio amplifier and class-AB headphone driver. Featuring power-limit technology for speaker protection and an advanced dc volume control for precise 64-step gain adjustment, this amplifier minimizes external components to achieve a highly-integrated solution in compact 20-pin QFN or 24-pin

Read more

Infineon Technologies AG has announced a family of robust 650V IGBTs that can deliver highest efficiency in fast switching automotive applications. The AEC-Q-qualified TRENCHSTOP™ 5 AUTO IGBTs will reduce power losses and improve reliability in electric vehicle (EV) and hybrid electric vehicle (HEV) applications such as on-board charging, power factor correction (PFC), dc-dc and dc-ac conversion. Recommended: 3W Power Supplies

Read more

Murata Power Solutions‘ OKDx-T/20-W12 and OKDx-T/25-W12 series of point of load (PoL) dc-dc converters offer high power density, high efficiency, PMBus™ compatible digital power solutions for space constrained embedded applications such as powering CPUs, datacom/telecom systems, distributed bus architectures (DBA), programmable logic, and mixed voltage systems in the networking, computing/servers, telecom, and industrial market sectors. Recommended: New teraAMP Standard AMP’s

Read more