admin

27
Feb

Dual Inductor targets High Temperature Class D Amplifiers

Vishay Intertechnology, Inc. today introduced the first device in its new IHLD series of low-profile, high-current dual inductors. Offering two inductors in one 4032 package, the space-saving automotive-grade IHLD-4032KB-5A is the industry’s first dual inductor to offer a high operating temperature range to +155 degrees C. The Vishay Dale inductor released today is optimized for automotive and commercial class D

Read more

27
Feb

High Isolation, Linear Current Sensor with 850 µΩ Current Conductor

Allegro MicroSystems, LLC announces two new current sensor ICs that are economical, high isolation solutions for ac or dc current sensing in industrial, commercial, and communications systems. Allegro’s ACS717 and ACS718 devices have a very small package that is well-suited for space constrained applications, though the wide-body provides the creepage and clearance needed for high isolation. Typical applications include motor

Read more

27
Feb

MCUs with Two Independent, Closed-Loop Power Channels

Microchip Technology Inc. today announced from the Embedded World conference in Germany a new family of 8-bit PIC® Microcontrollers (MCUs) with the PIC16(L)F1769 family. This family is the first PIC MCU to offer up to two independent closed-loop channels. This is achieved with the addition of the Programmable Ramp Generator (PRG), which automates slope and ramp compensation, increases stability and

Read more

27
Feb

650V / 300A Modules designed for EV/HEV inverters

Mitsubishi Electric Corporation has developed a new J-Series transfer molded power semiconductor module (T-PM) mainly for motor drive applications in electric and hybrid vehicles. This new series is a compact power semiconductor module, the newest addition to Mitsubishi Electric’s J-Series T-PMs mainly for electric and hybrid vehicle motor drive applications. The new module is expected to contribute to further compactness,

Read more

27
Feb

Encapsulant Offers Clear Protection for Outdoor LED Lighting

Dow Corning introduced Dow Corning® EI-1184 Clear Encapsulant for demanding outdoor LED lighting applications at the Strategies in Light exposition (Booth #827). Featuring high transparency and weatherability, the two-part silicone encapsulant delivers reliable, long-lasting protection of sensitive LED electronics in environments containing moisture, ultraviolet (UV) light, thermal cycling and extreme temperatures for both indoor and outdoor lamp and luminaire applications.

Read more

27
Feb

Low-Profile 75W Triple-Output 3 x 5 Power Supplies

TDK Corporation announces the introduction of TDK-Lambda’s CUT75 low-profile, triple-output power supplies. In the industry standard 3″ x 5″ footprint, the series is just 1.06″ in height and is well suited for industrial, broadcast and test and measurement applications. Operating from a universal input voltage of 85- to 265-Vac, the CUT75 is available in two standard models. The CUT75-522 offers

Read more

27
Feb

250-Watt DC-DCs Encapsulated for Harsh Environments

VPT, Inc. introduced the availability of the VPT250-2800S Series of single-output 250-Watt isolated dc-dc converters to its high-reliability COTS VPT Series product line. The VPT250 is uniquely designed for the increasing power conversion needs in military vehicles, ships, weapons, and other rugged systems requiring high reliability solutions. Featuring VPT’s proprietary six-sided encapsulated package with an integral metalized EMI shield, the

Read more

27
Feb

Smartphone Fast Charging with Battery Analytics

Qnovo Corp. today announced a new approach to reducing mobile device battery-related returns. Qnovo Analytics (QNA) continuously monitors battery health and provides diagnostics to quickly resolve consumer battery issues. Mobile consumers cite battery issues as a top complaint, yet to date there have been few tools available to quickly pinpoint and resolve battery-related problems. Often this results in the consumer

Read more

27
Feb

Wireless MCU Platform for Batteryless IoT Connectivity

Texas Instruments, Inc. (TI) today announced the new SimpleLink™ ultra-low power wireless microcontroller (MCU) platform that helps customers go battery-less with energy harvesting or enjoy always-on, coin cell-powered operation for multiple years. With this industry-first technology, customers have the flexibility to develop products that support multiple wireless connectivity standards using a single-chip and identical RF design. The SimpleLink ultra-low power

Read more

27
Feb

Bias Generation and Level Setting Made Easy

Analog Devices, Inc. today introduced a single-chip, universal output D/A converter which combines a 16-bit data converter, ±2 ppm / degree C, 2.5-V reference, output buffer and gain scaling function on-chip. The innovative feature set of the AD5761R converter removes the need for external components, including gain setting precision resisters and amplifiers. In data acquisition and actuator control applications, this

Read more