Infineon Technologies AG today launched bipolar power modules in solder bond technology to address the specific requirements of cost-effective applications. With these new PowerBlock modules the company expands its already extensive power module portfolio which, so far, was only using pressure contacts. Infineon offers optimized solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and static switches driven by cost and/or performance restrictions.
Recommended: GaN and SiC may be made Obsolete by Gallium Oxide
With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder PowerBlock modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must. Whenever high robustness is a key criterion, like for soft starters or static switches, Infineon offers the pressure contacts as the best solution. For example, in an input rectifier application directly operating under harsh line voltage conditions the requirements for robustness increase with module size, demanding for the highly reliable pressure contact technology.
Related: Gate Driver Board and SPICE Models for SiC Junction Transistors
The PowerBlock modules with isolated copper base plate provide a lower transient thermal resistance than modules using only a DCB substrate for heat transfer to the heat sink. This leads to higher robustness in case of overload. The optimized housing and cover construction of the PowerBlock solder modules provide a very low torsion during screwing of the main terminals while the modules offer best in class soldering quality. In addition the modules show lowest power dissipation which leads to high system efficiency.
Infineon starts mass production of the 1600V PowerBlock modules (20mm and 34mm) with solder bond technology and different current classes in Q4, 2014. In addition, first samples of the 1600V PowerBlock 50mm solder modules will be available starting Q1, 2015.
source: http://www.powerpulse.net/story.php?storyID=31181
Comments are closed.