At this year’s PCIM 2015 trade showInfineon Technologies AG will present the latest generation of its PrimePACK™ power modules which benefit from the new generation of Infineon’s IGBTs. The combination of the IGBT5 and the innovative .XT interconnection technology is an important milestone in IGBT chip and interconnection technologies. The IGBT5 allows for higher power density with reduced static and
Eaton Corp. today announced new metered outlet power measurement capabilities for data centers with its best-in-class ePDU® third-generation (G3) platform in the Americas. Providing capabilities to monitor and measure critical factors such as voltage, current and power consumption, Eaton’s latest rack power distribution units (PDUs) help information technology (IT) and data center managers conserve energy with one percent billing grade
CMicrotek LLC is expanding their µCurrent Probe™ line of ultra-low current probes, optimized for the low current levels of small energy harvesting power sources. The newest member of the µCurrent Probe line is the µCP120™, extending the current range of the µCP100™ (5nA up to 100mA) for higher power applications. The µCP120 has a measurement range from 50nA up to
TDK Corporation has expanded its CCT series of clamp ac current sensors with two new types that are rated for 300A and 80A. The new sensors are designed for use in the power distribution panels in a variety of energy management systems. With a current transformation ratio of 3000:1 the 300-A and 80-A types offer maximum output currents of 100
Absopluse Electronics has released a 1kVA version of its IP66-rated line of inverters, effectively doubling the level of sine wave ac power available on these heavy-duty designs. The CSI 1K-24/230-3XD3, a microprocessor-controlled high frequency pwm inverter, delivers 230Vac continuous at 50Hz and accepts a 24Vdc nominal input voltage (21-30Vdc range). Input and output are via sealed circular connectors, cable glands
Truly Semiconductors Limited (Truly) andSunpartner Technologies signed a partnership to develop the first turnkey display modules integrating Wysips® Crystal technology, for the smartwatch market and other mobile electronics. Wysips® Crystal solar recharging technologies transform any surface into a source of electricity using natural or artificial light without impacting aesthetics-like a perpetual power reserve. Installed under the touchscreen panel during the
To be premiered next week at PCIM Europe 2015, STMicroelectronics‘ powerSTEP driver delivers the advantages of compact motor-control design for applications at high power ratings. The fully-integrated stepper-motor driver system-in-package offers an unprecedented power density of up to 500W/cm², enabling cost-effective systems that deliver better performance and reliability without sacrificing flexibility or ruggedness. Recommended: 5A Charger IC Cuts Charge Time
Murata Manufacturing Co., Ltd. has expanded its lineup of 1206-size (3.2mm x 1.6mm) and 1210-size (3.2mm x 2.5mm) monolithic ceramic capacitors (MLCCs) (GRM series) in the range exceeding 100µF with the addition of new products rated at 150µF, 220µF, and 330µF. Compared with the polymer capacitors typically used in the range above 100µF, Murata MLCCs deliver better ESR characteristics and
LAPIS Semiconductor, a ROHM Group Company, has recently announced the development of a low-power microcontroller (MCU) that integrates an 8-bit core, speech synthesis circuit, high-efficiency Class-D speaker amp, non-volatile memory, and oscillator circuit on a single chip, making audio playback possible by simply connecting to a speaker. The ML610Q304 also provides hardware-based audio playback operation that minimizes the load placed
Analog Devices, Inc. today introduced a FET input AFE with an integrated ADC driver designed to interface directly with current mode sensors such as photo diodes and high output impedance voltage sensors. The ADA4350 integrates a FET input amplifier, switching network and ADC driver into a single package, which simplifies design and lowers power and PCB footprint by more than