Industry news

XP Power plc today announced the EML30 series of 30-Watt single-output ultra-compact ac-dc power supplies designed for use in medical applications. The EML30 series claims the smallest footprint and the highest power density in the industry when compared to other similar 30-Watt power supplies with medical safety approvals. The EML30 series also claims more mechanical formats and mounting options than

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Diodes Incorporated has introduced a family of micro-power 8-bit resolution Hall effect sensors for contactless switching in portable consumer electronic products, domestic appliances and industrial equipment. Operating over a supply range of 1.6V to 3.6V and a magnetic range of ±400G, the sensors allow the operating mode and sampling rate to minimize current consumption down to micro-power levels. The AH8500

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Semtech Corp. today announced the uClamp3601P – a 33V, high-performance transient voltage suppression (TVS) device for protecting industrial sensors. The single-line uClamp3601P achieves the low-clamping voltage performance needed to safeguard today’s small form factor proximity sensors from ESD, EFT and low level surge transients. The uClamp3601P, built on Semtech’s leading edge process technology, achieves a low ESD clamping voltage in

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Microchip Technology Inc. today announced the expansion of its non-volatile Digital-to-Analog Converter (DAC) product line with the MCP47FEBXX devices. The low-power, single- and dual-channel DACs feature 8-, 10- and 12-bit resolution, integrated EEPROM and an I2C™ interface, and are offered in 8-pin TSSOP packages. The DACs are designed for applications in the consumer and industrial markets, such as wireless microphones,

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American Bright Optoelectronics Corp.offers ac-compatible LED solutions capable of producing up to 86lm/W without the need for external ac-dc conversion. The second-generation GoldenEye implements American Bright’s patented SimpleDrive® technology that eliminates the need for capacitors, resistors and chokes and allows users to connect the module directly to 120Vac line voltages. Third party independent testing (LM84) confirms that the new device

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OnChip Devices, Inc. has introduced miniature, wire bondable, silicon ESD-protection diodes targeted for high-brightness and power LED markets. The ESD88NP and ESD88PN are designed to redirect high transient currents away from sensitive LED and IC products. These Zeners exhibit no device degradation when compared to multilayer varistors. All devices meet the requirements of IEC61000 and safely dissipate ESD strikes of

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Cambrios Technologies Corporationand Heraeus Group announced a new class of hybrid, transparent, conductive materials made of silver nanowires and conductive polymers. Combining ClearOhm® silver nanowires with Clevios™ PEDOT:PSS conductive polymer creates a new hybrid “one layer solution” resulting in the highest conductivity coupled with an ultra-smooth surface. The new Clevios™ HY family of products will have superior conductivity on flexible

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Toshiba Corporation‘s Semiconductor and Storage Products Company today announced the launch of a new surface-mount package series in its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation. The shipment of the 4 new products in the “DSOP Advance package” series starts immediately. Recommended: NXP claims World-Thinnest Medium-Power Schottkys The new devices have a heat sink

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The STWBC digital controller for wireless battery charger (WBC) transmitters fromSTMicroelectronics, Inc. claims the most flexible and efficient solution for controlling power transfer from a WBC transmitter (TX) to a receiver (RX) in WBC-enabled phones, wearables, and other battery-powered devices that use electromagnetic induction for re-charge. As a member of the Qi Wireless Power Consortium and the PMA (Power Matters

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Fairchild Semiconductor Corp.announced today the availability of its next generation PowerTrench® MOSFETs for automotive applications in the high-power TO-Leadless (TO-LL) package (JEDEC MO-299). The innovative TO-LL technology offers an extremely low package resistance, a very small footprint, and allows for exceptionally good EMI behavior. Typical automotive power electronics applications for the TO-LL packaged devices include battery management for electric and

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