HomeIndustry news High-Density Open-Frame 200W and 150W AC-to-DCs

High-Density Open-Frame 200W and 150W AC-to-DCs

June 19, 2015 By admin Comments are Off , , , ,

GE’s Critical Power business today announced two new additions to its open-frame, Compact Low Power (CLP) family of ac-dc power supplies — its CLP0224FP and CLP0112FP. These new solutions complement the already released CLP0212FP solution, a 200W, 12V ac-dc solution. The CLP0224FP, 200W, 24V power supply delivers efficiencies of greater than 90 percent in a compact, high-density 2-by-4-inch footprint at 18W/inch3. The CLP0112FP offers similar leading efficiency levels in a comparable footprint but at 150W and 12V. This exceptional density is achieved with outstanding thermal performance and Class B conducted emissions.

Both CLP0224FP and CLP0112 deliver power efficiency of greater than 90 percent at typical and full-load outputs and at temperatures up to 50 degrees C (122 degrees F) — with higher temperature operation possible at derated output. With an 80 Plus Gold efficiency rating, the power supply minimizes losses at low loads, helping to reduce operating expenses. In addition, the CLP-series power supplies employ a unique design approach for their power level, leveraging zero-voltage switching techniques in conjunction with quasi-resonant power factor correction circuits.

“GE’s open-frame CLP power supplies help build more capacity and high-density designs across a broad range of communications, computing, data storage and industrial applications,” said Karim Wassef, general manager of Embedded Power, GE’s Critical Power business. “The CLP family’s reduced footprint makes the power supplies ideal to handle challenges associated with tight-space and low-airflow applications.”

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Examples of these space- and airflow-constrained applications include small-cell remote radio head, small- and medium-sized routers and switches, ATM machines, time stamp card readers, outdoor billboards and signs, LED lighting, stage lighting, audio speakers and test and instrumentation equipment (oscilloscope). The CLP-family’s advanced thermal management capabilities also contribute to its wide range of possible applications.

The CLP’s fanless conduction-cooling feature increases the power supply’s reliability since there are no moving parts. With heat-generating components deliberately placed on the bottom of the printed circuit board, GE’s new CLP-series power supplies enable heat removal to be maximized using heat sinks. These factors contribute to a single CLP module being able to support an extended temperature range of minus 40 to 85 degrees C. Additional protection features include over-current, over-voltage and over-temperature protection.

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Key features and benefits include: Open-framed, fanless, conduction-cooled front-end power supply. Space-efficient 2-by-4-by-1.4-inch form factor. Universal ac input range (90 to 264 Vac). Full load capability at 50 degrees C and 200 linear feet per minute airflow. Extended temperature range of minus 40 to 85 degrees C. Meets Class B Conducted Emissions requirements with 3-decibel margin. And these power supplies can be used at 5,000-meter altitude.

GE’s CLP0224FP and CLP0112FP ac-dc power supplies are now available in volume quantities. Pricing begins at $65 per module at an annual volume of 1,000 units for CLP0224FP and $55 per module at an annual volume of 1,000 units for CLP0112FP.

source: http://www.powerpulse.net/story.php?storyID=32447

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