Medium-Power Transistors with Solderable Side Pads

NXP Semiconductors has introduced their first medium-power general-purpose transistors with solderable sidepads in DFN2020D-3 (SOT1061D). The 23 new types with Vceo values of 20-80 V offer a collector current of 1-2 A on just a 2×2 mm small footprint. All types are AEC-Q101 qualified and come with an exposed heat sink for excellent thermal and electrical performance. They are also suitable for automatic optical inspection (AOI).

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In comparison to the SOT89, our new transitors have 80% board space reduction. A low package height of only 0.62 mm makes the new product ideally suitable for space-constrained power management applications. The new types complete the medium-power general-purpose transistor portfolio that now include more than 100 types in packages DFN2020, SOT89 and SOT223.

Key features and benefits: High collector current capability IC (up to 2 A) and ICM (up to 3 A); VCEO ranging from 20 V to 80 V; Well-suited for space-constrained medium-power applications; High-power dissipation capability; Exposed heat sink for excellent thermal and electrical performance; High energy efficiency due to less heat generation; Leadless, very small SMD plastic package with medium-power capability; 100% solderable sidepads, suitable for automatic optical inspection (AOI); and AEC-Q101 qualified.

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Key applications are expected to include: Linear voltage regulators; Battery-driven devices; MOSFET drivers; Low-side switches; Power management; and Amplifiers.

source: http://www.powerpulse.net/story.php?storyID=32610

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