Tag: battery industry

The AH376xQ family of AECQ100-qualified Hall-effect latches introduced byDiodes Incorporated offers eight magnetic sensitivity options to cover the requirements of numerous automotive applications. Such uses include commutation, encoding and position control of the various motors, pumps, fans and valves found in vehicle cabins for operating windows, sun roofs, seats, tailgates and air-conditioning. These Hall-effect latches can also be used in

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Efficient Power Conversion Corp. ( EP)C announces the EPC2107 (100V) and EPC2108 (60V) eGaN® half-bridge power integrated circuits with integrated bootstrap FET, eliminating gate driver induced reverse recovery loses as well as the need for a high-side clamp. This is the first time that a bootstrap FET has been integrated in an eGaN power circuit. Recommended: High-Efficiency Buck-Boost Regulator for

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AVX Corporation has extended its high-temperature AT Series MLCCs with two new case sizes (0603 and 0805), two new voltage ratings (16V VHT 25 degrees C and 25V VHT 200 degrees C), and new C0G and VHT temperature coefficients that differentiate the 200 degrees C parts from the industry-leading 250 degrees C parts. Designed to accommodate emerging military and commercial

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Texas Instruments (TI) (NASDAQ: TXN) claims the industry’s first current-sense amplifier to integrate a high-precision, low-drift shunt resistor, which can deliver highly accurate measurements over a wide temperature range. TI’s INA250 integrates the shunt resistor with a bi-directional, zero-drift current-sense amplifier to support both low-side and high-side implementations. Its accuracy and low drift reduce or may eliminate designers’ calibration effort

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AVX Corporation has introduced the new radial leaded CapGuard™ Automotive Series. Combining multilayer varistor (MLV) and high capacitance, temperature stable X7R multilayer ceramic capacitor (MLCC) technology in a single, high-reliability device, the new CapGuard Series exhibits bi-directional transient voltage protection, excellent EMI/RFI attenuation over a wide frequency spectrum, and multi-strike capabilities in a compact, radial configuration with a conformal epoxy

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TDK Corporation presents two new series of EPCOS MMKP capacitors, which employ a film that is metallized on both sides. The new capacitors offer particularly high pulse strength as well as a high current capability. Depending on the type and frequency, the permissible current can be up to more than 10Arms. An iimportant feature is the compact design of the

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Würth Elektronik eiSos GmbH & Co. KGnow offers wireless power coils for wearables. Since devices such as fitness sensors and smart watches are generally encapsulated to protect them from the effects of the environment, but due to the variety of integrated sensory components (GPS, radio) have to be recharged frequently, the contactless transfer of energy without a charging plug is

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The DMN2014LHAB and DMN2011UFX dual N-channel enhancement mode MOSFETs introduced by Diodes Incorporated provide a compact, bi-directional low-loss switch for battery-charging circuits. End-markets include chargers for portable devices such as smartphones, tablets, cameras and media players, which use 1-cell and 2-cell lithium batteries. Recommended: Wireless Power Coils for Wearables The DMN2014LHAB and DMN2011UFX are configured as dual common-drain MOSFETs and,

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Vishay Intertechnology, Inc. announced that its RCP series of thick film chip resistors for high-power, surface-mount RF applications is now available in the compact 0505, 0603, and 2512 case sizes. The Vishay Dale devices offer very high thermal conductivity for power ratings up to 22W with active temperature control. Optimized for many applications in the automotive, aerospace, military, industrial, and

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Litecool has produced LED packages in a vertical orientation rather than horizontal. This means that the dielectric layers only have a minor impact on the thermal performance of the LED package and allow the heat to escape more effectively through the metallic parts of the package. This has significant benefits for flip-chip packaging where dielectric layers are usually very close

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