Tag: battery industry

ams AG today launched the AS3955, an NFC interface chip (NFiC™) which offers unique energy harvesting and data transfer capabilities. Like its predecessor the AS3953, the AS3955 provides a contactless bridge between an NFC reader (for instance, a smartphone or tablet) and any microcontroller. But the AS3955 can also act as a power supply for the host device, harvesting as

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Toshiba Semiconductor has launched a high – current 4500V, 1200A power module for use in rail traction, industrial motor control, renewable energy systems and electricity transmission and distribution applications. The MG1200GXH1US61 PMI (plastic case module IEGT) integrates an N-channel IEGT (injection-enhanced gate transistor) and a fast recovery diode (FRD) into a standard package with a footprint of just 140mm x

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IXYS Corporation has introduced a new family of power modules, series E2 and E3, with PressFit-Pins (PFP) connector technology. The E2/E3 family represents a compact power platform with the standard 17mm height that provides optimal high power density and excellent thermal conductivity. The new design for the E2/E3 with PressFit-Pins gives highest reliability for the application. It allows the designer

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TDK Corporation announces the successful development of the HMS series of compact unit type power supplies including four models rated for 50 W, 80 W, 100 W, and 150 W, to meet a wide range of customer needs. TDK-Lambda Corporation will start accepting orders for the new products from June, and mass production will begin in July 2015. Recommended: 1kVA

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GE‘s CP2500DC45PE-F compact power line dc-dc converter with front input connector features an input current of 40 to 72 Amps and programmable output voltage range from 44 to 58 Volts, providing high-density Power over Ethernet (POE)-compliant power in a minimal form factor. Part of the company’s recently launched rectifier portfolio, the new converter has been specifically designed to operate as

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Vishay Intertechnology, Inc. today introduced 28 new 600V and 650V FRED Pt® Gen 4 Ultrafast recovery diodes optimized for high-frequency converters in power modules, motor drives, UPS, solar inverters, and welding machine inverters. Offered as die in wafer form, Vishay Semiconductors “H” and “U” series devices offer ultra-low forward voltage and reverse recovery charge to reduce losses and increase efficiency,

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GeneSiC Semiconductor announces the immediate availability of a 20-mΩ 1200-V SiC junction transistor and diodes in an isolated, 4-leaded mini-module packaging that enables extremely low Turn-On energies losses while offering flexible, modular designs in high frequency power converters. The use of high frequency, high voltage and low on-resistance capable SiC transistors and rectifiers will reduce the size/weight/volume of electronics applications

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AVX Corporation has added a single-contact, wire-to-board (WTB) insulation displacement connector (IDC) with plated through hole (PTH) terminations to its 9176 Series, which, prior to the addition, was exclusively comprised of surface mount technology (SMT) connectors. Delivering the same features and benefits for which the 9176 Series is known — including a gas-tight connection to the PCB for long-term reliability,

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Toshiba Corporation has launched the TB9051FTG, a small-sized motor driver IC for dc brushed motors intended primarily for automotive electronic throttle control. The TB9051FTG offers highly efficient operation and a small P-QFN28 package (6mm x 6mm), realized by its ultra-low on-resistance, the result of applying DMOS transistors as driver circuits. Sample shipments will start in September 2015, with mass production

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Panasonic Corporation today announced that it will launch the industry’s smallest enhancement-mode gallium nitride (GaN) power transistors in the X-GaN™ package. The GaN is encapsulated into 8×8 dual-flat no-lead (DFN) surface-mount package. It is possible to mount the package on small area where it is difficult to mount conventionally and it is contribute to the reduction of the power consumption

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