Tag: battery industry

Micrel Inc. today introduced the MIC7400/MIC7401, a new family of highly integrated and configurable power-management IC (PMIC) solutions featuring six independent dc-dc regulators. Available in a small 4.5mm x 4.5mm FQFN package, this product family provides one of the industry’s highest power density solutions with total solution size of 12mm x 8mm x 1mm. The MIC7400/MIC7401 combine a total of

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To meet the demands of measuring transient currents in semiconductors using new technology, such as SiC and GaN, Power Electronic Measurements Ltd. (PEM) has designed the CWT MiniHF Rogowski current probe. Combining a novel shielding technique, utilizing a low sensitivity coil and patented low-noise signal-conditioning circuitry, the wide-band screened probe boosts immunity to local dV/dt transients while maintaining small size,

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Vicor Corporation announced the expansion of the DCM Converter Module Series of isolated, regulated DC-DC converters within Vicor’s Converter housed in Package™ (ChiP) power component platform. This series now covers critical applications in Aerospace, EV/HEV, Rugged Systems, Industrial, and Telecom/Datacom. DCMs provide nominal input voltages of 24, 28, 48, 270, 290, and 300 Volts with nominal outputs of 48, 36,

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NXP Semiconductors N.V. today announced its new GreenChip power solution, the TEA1916+TEA1995 platform – an innovative and easy-to-design new Resonant LLC solution targeted for desktop PC/AiO, gaming consoles, notebook adapters and large panel TVs. Building on NXP’s success as the market leader in GreenChip power ICs, the new TEA1916+TEA1995 Platform offers very high efficiency over the entire load range, especially

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Gowanda Electronics has introduced its new SMP2512 Series of surface-mount, wirewound, ferrite core, molded power inductors. This series addresses a market need for a specific combination of size and performance in the power electronics industry and is designed for use in power applications for specific surface mount size – nominally 0.25 inch L x 0.10 inch W – and current

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Fujitsu Laboratories Ltd. announced the development of the world’s first thin cooling device designed for small, thin electronic devices. Smartphones, tablets, and other similar mobile devices are increasingly multifunctional and fast. These spec improvements, however, have increased heat generated from internal components, and the overheating of localized parts in devices has become problematic. Fujitsu has developed a thin loop heat

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Intersil Corporation today claimeded the industry’s first 50A fully encapsulated digital dc-dc PMBus power module. The ISL8272M is a complete step-down power supply that delivers up to 50A of output current from industry standard 12V or 5V input power rails, and four modules can be combined to support up to 200A rails. It provides point-of load conversions for advanced FPGAs,

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Texas Instruments, Inc. (TI) today introduced the industry’s first 80-V, 10-A integrated gallium-nitride (GaN) FET power-stage prototype, which consists of a high-frequency driver and two GaN FETs in a half-bridge configuration – all in an easy-to-design quad flat no-leads (QFN) package. TI has an arranged supplier agreement with Efficient Power Conversion Corp. (EPC) for GaN FETs – the LMG5200 is

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Silego Technology, Inc. today announces the fourth generation of GreenPAK (GPAK) Mixed-signal Matrix ICs. The GPAK4 family strengthens Silego’s industry leading position in Configurable Mixed-signal ICs (CMIC). Silego’s GPAK4 family of NVM Programmable CMIC devices enables innovative designers to integrate many system functions such as comparators, ADCs, logic, delays, counters, resets, power sequencing, voltage sensing, and interface circuits while minimizing

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New zipper fin heat sinks from Advanced Thermal Solutions, Inc. (ATS) are protecting thousands of components from the dangers of excess heat at a lower cost than other high fin density heat sink types. Zipper fins are machined from thin sheet metal, typically aluminum or copper, and are formed into custom shapes. The sheets are designed to interlock with a

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