Tag: battery industry

Addressing the need for higher integration and efficiency in portable chargers, Diodes Incorporated has introduced two synchronous rectifiers: the APR3415 and APR34330. These devices combine a driver circuit with an internal MOSFET to provide cost effective rectification with reduced power dissipation and using fewer external components. Target applications include adapters/chargers for cellular and cordless phones, ADSL modems, MP3 players, and

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Panasonic Corporation and Sansha Electric Manufacturing Co., Ltd., which offers the SanRex brand, today announced that they have developed a very compact SiC power module together with highly efficient operation of power switching systems. The SiC power module has sufficiently good reliability and greatly helps to reduce the size of power switching systems such as industrial inverters and power supplies.

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Linear Technology Corporationintroduces the LTC2956, a wake-up timer with pushbutton control that manages 1.5V to 36V system power. Using microcontrollers or real-time clocks to track timing overcomplicates many designs. Electronic devices used to perform routine tasks, such as monitoring human body temperature, monitoring strain in a bridge, or capturing images, benefit from adjustable timing options without the need to program

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Diodes Incorporated has introduced a family of micro-power 8-bit resolution Hall effect sensors for contactless switching in portable consumer electronic products, domestic appliances and industrial equipment. Operating over a supply range of 1.6V to 3.6V and a magnetic range of ±400G, the sensors allow the operating mode and sampling rate to minimize current consumption down to micro-power levels. The AH8500

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Microchip Technology Inc. today announced the expansion of its non-volatile Digital-to-Analog Converter (DAC) product line with the MCP47FEBXX devices. The low-power, single- and dual-channel DACs feature 8-, 10- and 12-bit resolution, integrated EEPROM and an I2C™ interface, and are offered in 8-pin TSSOP packages. The DACs are designed for applications in the consumer and industrial markets, such as wireless microphones,

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OnChip Devices, Inc. has introduced miniature, wire bondable, silicon ESD-protection diodes targeted for high-brightness and power LED markets. The ESD88NP and ESD88PN are designed to redirect high transient currents away from sensitive LED and IC products. These Zeners exhibit no device degradation when compared to multilayer varistors. All devices meet the requirements of IEC61000 and safely dissipate ESD strikes of

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Cambrios Technologies Corporationand Heraeus Group announced a new class of hybrid, transparent, conductive materials made of silver nanowires and conductive polymers. Combining ClearOhm® silver nanowires with Clevios™ PEDOT:PSS conductive polymer creates a new hybrid “one layer solution” resulting in the highest conductivity coupled with an ultra-smooth surface. The new Clevios™ HY family of products will have superior conductivity on flexible

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Toshiba Corporation‘s Semiconductor and Storage Products Company today announced the launch of a new surface-mount package series in its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation. The shipment of the 4 new products in the “DSOP Advance package” series starts immediately. Recommended: NXP claims World-Thinnest Medium-Power Schottkys The new devices have a heat sink

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The STWBC digital controller for wireless battery charger (WBC) transmitters fromSTMicroelectronics, Inc. claims the most flexible and efficient solution for controlling power transfer from a WBC transmitter (TX) to a receiver (RX) in WBC-enabled phones, wearables, and other battery-powered devices that use electromagnetic induction for re-charge. As a member of the Qi Wireless Power Consortium and the PMA (Power Matters

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Fairchild Semiconductor Corp.announced today the availability of its next generation PowerTrench® MOSFETs for automotive applications in the high-power TO-Leadless (TO-LL) package (JEDEC MO-299). The innovative TO-LL technology offers an extremely low package resistance, a very small footprint, and allows for exceptionally good EMI behavior. Typical automotive power electronics applications for the TO-LL packaged devices include battery management for electric and

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