Tag: industry news

Vishay Intertechnology, Inc. has introduced three new devices in its new 600 V EF Series of fast body diode n-channel power MOSFETs. With low reverse recovery charge and on-resistance, the Vishay Siliconix SiHx21N60EF, SiHx47N60EF, and SiHx70N60EF with current ratings from 21- to 70-A increase reliability and save energy in industrial, telecom, computing, and renewable energy applications. Recommended: 12V 500W Quarter

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Advanced Thermal Solutions, Inc., has introduced clipKIT™, a heat sink attachment system that can be used with most industry standard, off the shelf straight fin, pin fin, cross cut or slant fin heat sinks. The new system improves on heat sink performance in thermal transfer, and vibration and shock resistance. The clipKIT™ line is available exclusively from Digi-Key. clipKIT is

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Falcon Electric, Inc. has announced the expansion of its SSG Series Industrial UPS product line. The SSG rackmount and tower family now spans power levels from 1kVA to 6kVA that address a broad range of demanding industrial and process control applications. Like Falcon’s other SSG models, the 4 to 6kVA units are rugged, rackmount on-line uninterruptible power supplies (UPSs) that

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Stadium Power announced the addition of the 60W ac-input G1X2 and DG1X2 48Vdc input models to their range of 1+1 redundant 1U industrial single output and ATX / EPS power supplies. These are optimized for secure bulk power applications including digital imaging, communication systems, industrial PCs and telecom or broadcast systems. The power supplies have a long term track record

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Vishay Intertechnology, Inc. introduced a new series of low-profile, high-current power inductors featuring powdered iron cores for high saturation current up to 5.8A. Lowering costs and saving board space in computer, consumer, and telecom applications, Vishay Dale IHHP series devices are offered in the miniature 2.0 mm by 1.6 mm 0806 and 2.5 mm by 2.0 mm 1008 case sizes,

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Littelfuse, Inc., has introduced four solutions for general purpose ESD protection TVS Diode Arrays (SPA® Diode) that occupy less board space than similar industry offerings. The SP1013 and SP1014 TVS Diode Arrays fit into a standard 0201 footprint but offer a 30 percent reduction in the board space required over other 0201 outline solutions, allowing more clearance between components. The

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TDK Corporation announces the introduction of high temperature resistant MLCCs with soft terminations, expanding the CGA series of MLCCs for automotive applications. These components employ electrodes made of conductive resins that provide effective protection against solder cracks caused by thermal cycling, flex cracks caused by stress to the PCB, and damage due to vibrations and shocks. In addition, the new

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Semtech Corporation today announced the SC563, a dual-output low dropout (LDO) regulator in a tiny 1.6mm x 1.2mm, 8 pin MLPD package. The SC563 LDO provides two regulated outputs for up to 300mA for each output channel. The LDO accepts an input supply rail of 2.3V to 5.5V and provides two fixed, regulated outputs, which eliminate the need for external

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Eaton Corp. today announced the launch of its automotive grade Coiltronics® HCMA Series of high-current power inductors to meet and exceed the Automotive Electronics Council’s (AEC) Q200 Grade 3 standard with a maximum total temperature operation range from minus 55 to 125 degrees C. The HCMA Series is provided in surface mount packaging with a range of compact heights beginning

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Efficient Power Conversion Corporation (EPC) announces the introduction of two eGaN FETs that raise the bar for power conversion performance. These products have a maximum operating temperature of 150 degrees C and pulsed currents capabilities of 260A (150 V EPC2033) and 140A (EPC2034). Applications include dc-dc converters, synchronous rectification in dc-dc and ac-dc converters, motor drives, LED lighting, and industrial

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