Tag: industry news

22
May

Power Modules with PressFit-Pins and Phase Change Material

IXYS Corporation has introduced a new family of power modules, series E2 and E3, with PressFit-Pins (PFP) connector technology. The E2/E3 family represents a compact power platform with the standard 17mm height that provides optimal high power density and excellent thermal conductivity. The new design for the E2/E3 with PressFit-Pins gives highest reliability for the application. It allows the designer

Read more

22
May

Power Supplies Operate from 80 to 370-Vdc or 85 to 265-Vac

TDK Corporation announces the successful development of the HMS series of compact unit type power supplies including four models rated for 50 W, 80 W, 100 W, and 150 W, to meet a wide range of customer needs. TDK-Lambda Corporation will start accepting orders for the new products from June, and mass production will begin in July 2015. Recommended: 1kVA

Read more

20
May

DC-DC Converter Targets PoE Applications

GE‘s CP2500DC45PE-F compact power line dc-dc converter with front input connector features an input current of 40 to 72 Amps and programmable output voltage range from 44 to 58 Volts, providing high-density Power over Ethernet (POE)-compliant power in a minimal form factor. Part of the company’s recently launched rectifier portfolio, the new converter has been specifically designed to operate as

Read more

20
May

Ultrasoft Ultrafast Diodes Reduce Conduction Losses

Vishay Intertechnology, Inc. today introduced 28 new 600V and 650V FRED Pt® Gen 4 Ultrafast recovery diodes optimized for high-frequency converters in power modules, motor drives, UPS, solar inverters, and welding machine inverters. Offered as die in wafer form, Vishay Semiconductors “H” and “U” series devices offer ultra-low forward voltage and reverse recovery charge to reduce losses and increase efficiency,

Read more

20
May

Co-Packaged SiC Transistor and Diodes in Mini-Modules

GeneSiC Semiconductor announces the immediate availability of a 20-mΩ 1200-V SiC junction transistor and diodes in an isolated, 4-leaded mini-module packaging that enables extremely low Turn-On energies losses while offering flexible, modular designs in high frequency power converters. The use of high frequency, high voltage and low on-resistance capable SiC transistors and rectifiers will reduce the size/weight/volume of electronics applications

Read more

20
May

Single-Contact IDC Connector with PTH Terminations

AVX Corporation has added a single-contact, wire-to-board (WTB) insulation displacement connector (IDC) with plated through hole (PTH) terminations to its 9176 Series, which, prior to the addition, was exclusively comprised of surface mount technology (SMT) connectors. Delivering the same features and benefits for which the 9176 Series is known — including a gas-tight connection to the PCB for long-term reliability,

Read more

20
May

Driver IC for DC Brushed Motor for Automotive Controls

Toshiba Corporation has launched the TB9051FTG, a small-sized motor driver IC for dc brushed motors intended primarily for automotive electronic throttle control. The TB9051FTG offers highly efficient operation and a small P-QFN28 package (6mm x 6mm), realized by its ultra-low on-resistance, the result of applying DMOS transistors as driver circuits. Sample shipments will start in September 2015, with mass production

Read more

20
May

Smallest Enhancement-Mode 600V GaN Power Transistors

Panasonic Corporation today announced that it will launch the industry’s smallest enhancement-mode gallium nitride (GaN) power transistors in the X-GaN™ package. The GaN is encapsulated into 8×8 dual-flat no-lead (DFN) surface-mount package. It is possible to mount the package on small area where it is difficult to mount conventionally and it is contribute to the reduction of the power consumption

Read more

20
May

Panasonic Claims Smallest PhotoMOS SSR

Panasonic Corporation announced today that it has developed the industry’s smallest semiconductor device, the PhotoMOS CC type series solid-state relays (SSRs), which achieves low consumption current and contributes to equipment downsizing. The relay is operated with a low consumption current, and as a result the working time of the battery operating the equipment is longer. It enables steady operation for

Read more

20
May

Glass Encapsulated Automotive Multilayer Varistors

AVX Corporation has added a new 1206 chip size and extensive new voltage, clamping voltage, and energy ratings to its Glass Encapsulated TransGuard® and TransGuard Automotive Series multilayer varistors. Comprised of zinc oxide (ZnO) based ceramic semiconductor devices with non-linear, bi-directional voltage-current (V-I) characteristics similar to those of back-to-back Zener diodes, both multilayer varistor series provide bi-directional overvoltage protection and

Read more