Tag: new energy news

17
Mar

Resonant LLC Platform features Low-Load Efficiency and Ease-of-Design

NXP Semiconductors N.V. today announced its new GreenChip power solution, the TEA1916+TEA1995 platform – an innovative and easy-to-design new Resonant LLC solution targeted for desktop PC/AiO, gaming consoles, notebook adapters and large panel TVs. Building on NXP’s success as the market leader in GreenChip power ICs, the new TEA1916+TEA1995 Platform offers very high efficiency over the entire load range, especially

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17
Mar

Surface-Mount Inductors target Applications Needing up to 1.6A

Gowanda Electronics has introduced its new SMP2512 Series of surface-mount, wirewound, ferrite core, molded power inductors. This series addresses a market need for a specific combination of size and performance in the power electronics industry and is designed for use in power applications for specific surface mount size – nominally 0.25 inch L x 0.10 inch W – and current

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17
Mar

Heat Pipe under 1mm Thick Achieves 5X Thermal Transfer

Fujitsu Laboratories Ltd. announced the development of the world’s first thin cooling device designed for small, thin electronic devices. Smartphones, tablets, and other similar mobile devices are increasingly multifunctional and fast. These spec improvements, however, have increased heat generated from internal components, and the overheating of localized parts in devices has become problematic. Fujitsu has developed a thin loop heat

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17
Mar

Fully-Encapsulated 50A Digital Power Module

Intersil Corporation today claimeded the industry’s first 50A fully encapsulated digital dc-dc PMBus power module. The ISL8272M is a complete step-down power supply that delivers up to 50A of output current from industry standard 12V or 5V input power rails, and four modules can be combined to support up to 200A rails. It provides point-of load conversions for advanced FPGAs,

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16
Mar

TI and EPC Partner on 80-V Half-Bridge GaN FET Module

Texas Instruments, Inc. (TI) today introduced the industry’s first 80-V, 10-A integrated gallium-nitride (GaN) FET power-stage prototype, which consists of a high-frequency driver and two GaN FETs in a half-bridge configuration – all in an easy-to-design quad flat no-leads (QFN) package. TI has an arranged supplier agreement with Efficient Power Conversion Corp. (EPC) for GaN FETs – the LMG5200 is

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16
Mar

Fourth-Generation of Programmable Mixed-signal Matrix ICs

Silego Technology, Inc. today announces the fourth generation of GreenPAK (GPAK) Mixed-signal Matrix ICs. The GPAK4 family strengthens Silego’s industry leading position in Configurable Mixed-signal ICs (CMIC). Silego’s GPAK4 family of NVM Programmable CMIC devices enables innovative designers to integrate many system functions such as comparators, ADCs, logic, delays, counters, resets, power sequencing, voltage sensing, and interface circuits while minimizing

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13
Mar

High Density Zipper Fins Improve Heat Sink Performance

New zipper fin heat sinks from Advanced Thermal Solutions, Inc. (ATS) are protecting thousands of components from the dangers of excess heat at a lower cost than other high fin density heat sink types. Zipper fins are machined from thin sheet metal, typically aluminum or copper, and are formed into custom shapes. The sheets are designed to interlock with a

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13
Mar

High-Performance SoC FPGA Dual-axis Motor Control Kit

Microsemi Corporation today announced availability of its SmartFusion2™ SoC FPGA dual-axis motor control kit with a modular motor control IP suite and reference design. The kit, which simplifies motor control designs using a single SoC FPGA, accelerates time to market and is scalable across multiple industries such as industrial, aerospace and defense. Typical applications include factory and process automation, robotics,

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13
Mar

Expanded Digital Controller Family targets POLs

ZMD AG (ZMDI) has released the ZSPM1507, ZSPM1508 and ZSPM1509 single-phase, true-digital pulse-width modulator (pwm) power controllers optimized for non-isolated point-of-load (POL) applications. The ZSPM1507, ZSPM1508 and ZSPM1509 are pre-configured to provide customers with a fast time-to-market and easy-to-design solution for high-performance, digitally controlled power supplies with one of ZMDI’s integrated MOSFET power stage DrMOS products: the ZSPM9000, ZSPM9010, ZSPM9015

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13
Mar

Dual-input Power Multiplexer ICs with Protection Features

Toshiba Corporation Semiconductor and Storage Products Company today announced the launch of power multiplexer ICs that can switch between two power sources, for use in charging circuits of mobile devices. Shipment of the new TCK32xG series starts from today. The new products can switch power sources through external signals and also through a built-in auto selection mode function, which switches

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