Tag: news

Panasonic Semiconductor Solutions Co., Inc. has extended its line of GaN power transistors with two new devices, the PGA26E19BV rated for 600V and 10A and the PGA26E08BV rated for 600V and 15A. These normally-off power switches are offered in an 8mm square 1.25mm thick package for high-density applications. They are fabricated on Panasonic’s 6-inch GaN-on-silicon process. Applications are expected to

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FieldView Solutions, Inc. today announced the availability of FieldView 2015 Data Center Infrastructure Management (DCIM) tools. The new solution’s innovations represent a dramatic leap forward in improving data center resilience by capturing, correlating and analyzing massive amounts of live data, enabling “What If?” simulation of potential failures, contemplated changes and planned maintenance downtime. Customizable dashboards enable vivid presentation of operational

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AVX Corporation has introduced the new TCR Professional Series tantalum chip capacitors with conductive polymer electrodes. Designed for use in high-power dc-dc converters employed in telecommunications, industrial, and avionics applications that demand high reliability and long lifetime performance, TCR Professional Series capacitors are subjected to AVX’s maverick part control Q-Process with statistical screening and process control enhancement to ensure the

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GaN Systems Inc. today announced new topside cooling technology in its wide range of high-power enhancement-mode devices. Topside cooling enables engineers to use conventional, well-understood PCB cooling techniques when incorporating GaN Systems’ market-leading semiconductors into their latest designs for products such as inverters, UPS, hybrid electric vehicles/electric vehicles, high voltage DC-DC conversion and consumer products such as TVs. Recommended: TI

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Micrel Inc. today introduced the MIC7400/MIC7401, a new family of highly integrated and configurable power-management IC (PMIC) solutions featuring six independent dc-dc regulators. Available in a small 4.5mm x 4.5mm FQFN package, this product family provides one of the industry’s highest power density solutions with total solution size of 12mm x 8mm x 1mm. The MIC7400/MIC7401 combine a total of

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To meet the demands of measuring transient currents in semiconductors using new technology, such as SiC and GaN, Power Electronic Measurements Ltd. (PEM) has designed the CWT MiniHF Rogowski current probe. Combining a novel shielding technique, utilizing a low sensitivity coil and patented low-noise signal-conditioning circuitry, the wide-band screened probe boosts immunity to local dV/dt transients while maintaining small size,

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Vicor Corporation announced the expansion of the DCM Converter Module Series of isolated, regulated DC-DC converters within Vicor’s Converter housed in Package™ (ChiP) power component platform. This series now covers critical applications in Aerospace, EV/HEV, Rugged Systems, Industrial, and Telecom/Datacom. DCMs provide nominal input voltages of 24, 28, 48, 270, 290, and 300 Volts with nominal outputs of 48, 36,

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NXP Semiconductors N.V. today announced its new GreenChip power solution, the TEA1916+TEA1995 platform – an innovative and easy-to-design new Resonant LLC solution targeted for desktop PC/AiO, gaming consoles, notebook adapters and large panel TVs. Building on NXP’s success as the market leader in GreenChip power ICs, the new TEA1916+TEA1995 Platform offers very high efficiency over the entire load range, especially

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Gowanda Electronics has introduced its new SMP2512 Series of surface-mount, wirewound, ferrite core, molded power inductors. This series addresses a market need for a specific combination of size and performance in the power electronics industry and is designed for use in power applications for specific surface mount size – nominally 0.25 inch L x 0.10 inch W – and current

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Fujitsu Laboratories Ltd. announced the development of the world’s first thin cooling device designed for small, thin electronic devices. Smartphones, tablets, and other similar mobile devices are increasingly multifunctional and fast. These spec improvements, however, have increased heat generated from internal components, and the overheating of localized parts in devices has become problematic. Fujitsu has developed a thin loop heat

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